1/2.7-inch IMX376 MIPI Sensor Camera Module

Product Description:

This 1/2.7-inch IMX376 MIPI Sensor Camera Module ,is a high-resolution MIPI interface camera module equipped with a high-performance 1/2.7-inch IMX376 image sensor. It delivers an effective pixel count of 5184×3880, enabling clear and detailed image capture across a wide range of shooting scenarios from close-up to long-distance. The module features a 3.81mm focal length lens with an F2.2 aperture, offering a 78° field of view and distortion below 0.5%. It delivers stable, true-to-life imaging, making it suitable for vision systems demanding high image quality and geometric fidelity. The module incorporates an autofocus motor supporting dynamic focusing with a working distance exceeding 10cm. Combined with optimized focusing algorithms, it achieves rapid and precise focusing even under complex shooting distances. Its precision-engineered, compact structure incorporates multi-layer FPC with steel reinforcement, delivering robust electromagnetic shielding and mechanical strength. Conductive foam grounding enhances signal stability and anti-interference capabilities, making it ideal for integration into space-constrained embedded vision devices demanding high reliability.

Features:

• High-Resolution Imaging with Low Distortion: Equipped with a 1/2.7inch IMX376 sensor supporting 20megapixel output (5184×3880), the module delivers exceptionally detailed images with minimal geometric distortion (<0.5%), making it ideal for applications requiring precise visual fidelity.
• Fast and Stable Autofocus Performance: Integrated with an autofocus motor and optimized focusing algorithm, the module achieves rapid and accurate focus adjustment across varying distances (focusing range >10 cm), ensuring consistent image clarity in dynamic shooting scenarios.
• Wide Field of View and Excellent Optical Performance: Featuring a 78° diagonal field of view and an F2.2 aperture, the module captures bright, wide angle images even in moderate lowlight conditions, providing balanced exposure and depth of field.
• Robust Mechanical and Signal Integrity Design: Constructed with multilayer FPC reinforced by steel sheets and shielded with conductive foam, the module offers enhanced mechanical durability, EMI resistance, and stable signal transmission, suitable for compact and reliabilitycritical embedded systems.

Technical Parameters:

Applications:

1.Mobile Device Main and Auxiliary Cameras:Suitable for integration as a primary or secondary camera in smartphones, tablets, and portable devices, providing high-resolution photography and video recording capabilities.

2.Industrial Machine Vision and Precision Inspection:Used in high-precision visual positioning, product defect detection, dimensional measurement, and automated quality control systems on industrial production lines.

3.Medical Imaging and Diagnostic Equipment:Applicable in endoscopic imaging, medical record photography, skin analyzers, and other diagnostic devices that require high-definition and low-distortion image capture.

4.Drones and Intelligent Transportation Systems:Deployed in drone aerial imaging, vehicle ADAS (Advanced Driver Assistance Systems), road condition monitoring, and license plate recognition for traffic management applications.

Customized Process:

1. You can provide drawings or samples, as well as request documentation and developed by our engineering staff.
2. Communication or Meeting
3. We will communicate with you in detail to determine somewhat product you need and try to set the most suitable product for you
according to your needs.
4. Sample Development
5. Determine the details of the development sample and the delivery time. Communicate at any time to ensure smooth progress.
6. Sample Testing
7. Test and age on your application, feedback test results, no need to modify, mass production.

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